Passive Cooling

Heatsink from standard to Customer specials.
Manufactured in aluminium, Copper and ceramic materials.

Laird Technologies

Manufacture some of the world’s highest-rated broad range of thermoelectric modules and thermal assemblies for medical, telecom, instrumentation, and other applications.

Products:
Thermoelectric Assemblies (TEA)
Thermoelectric Modules (TEM)·         Temperature Controllers
Liquid Cooling Systems (LCS)

Contact
Tomas Kahlström 
Phone +46 8 584 300 53 
E-mail. tomas@satco.se

ABC

Ceramic Heatsink and Coolers
Micropore gives a large surface area to sourrounding air.
Electrical insulated

Contact
Per Soderlund
Phone +46 8 584 300 63
​E-mail. per@satco.se

Radian Heatsinks

Heatsink for CPU and other electronic equipment.
With or without Fans.
​Wapor Chambers
Clips, adhesive and other solutions.
Custom Design.

Contact
Christer Sorving
Phone +46 8 584 300 55 
E-mail. christer@satco.se

Versarien

Traditionally micro-channels, fins and pins are used to increase the surface area to enable more effective movement of heat but with VersarienCu’s patented process we are able to increase the surface area significantly with the microporous nature of our copper foam improving performance and decreasing the likelihood of component failure.

Contact
Christer Sorving
Phone +46 8 584 300 55 
E-mail. christer@satco.se